Henkel Loctite 435 Equivalent Toughened &Clear Instant Adhesive
from Shirley(hengying@cnhybond.com 0086-18927302778 Skype:hengying11)
Product Description
CNHYBOND435 provides the following product
Characteristics:
Chemical Type: Ethyl cyanoacrylate
Appearance (uncured) Colorless : cloudy liquid LMS
Components One part - requires no mixing
Viscosity: Low
Cure: Humidity
Application: Bonding Key Substrates Metals, Plastics and Rubbers
CNHYBOND 435 is a rubber toughened adhesive with increased flexibility and peel strength along with enhanced resistance to shock. The product provides rapid bonding on a wide range of materials, including metals, plastics and elastomers, as well as porous and absorbent materials like wood, paper, leather and fabric.
Typical properties of uncured material
Specific Gravity @ 25 °C: 1.1
Viscosity, Cone & Plate, mPa·s (cP):
Temperature: 25 °C, Shear Rate: 1,000 s-1 100 to 250LMS
Viscosity, Cone & Plate, mPa·s (cP):
Temperature: 25 °C, Shear Rate: 1,000 s-1 100 to 250LMS
Typical curing performance
Under normal conditions, the atmospheric moisture initiates the curing process. Although full functional strength is developed in a relatively short time, curing continues for at least 24 hours before full chemical/solvent resistance is developed. Cure Speed vs. Substrate
The rate of cure will depend on the substrate used. The table below shows the fixture time achieved on different materials at 22 °C / 50 % relative humidity. This is defined as the time to develop a shear strength of 0.1 N/mm².
Fixture Time, seconds:
Steel (degreased) 30 to 45
Aluminum (IPA wiped) ≤60LMS
Zinc dichromate 90 to 105
Neoprene 30 to 45
Rubber, nitrile <5
SBR 90 to 105
ABS 10 to 20
PVC 60 to 75
Polycarbonate 45 to 60
Phenolic 10 to 20
G-10 Epoxy 45 to 60
Wood (oak) 75 to 90
Wood (balsa) <5
Cure Speed vs. Bond Gap
The rate of cure will depend on the bondline gap. Thin bond lines result in high cure speeds, increasing the bond gap will decrease the rate of cure.
Cure Speed vs. Activator
Where cure speed is unacceptably long due to large gaps, applying activator to the surface will improve cure speed. However, this can reduce ultimate strength of the bond and therefore testing is recommended to confirm effect.
Cure Speed vs. Time
The graph below shows the shear strength developed over time at 22 °C / 50 % RH on various substrates and tested according to ISO 4587.
General information
This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be selected as a sealant for chlorine or other strong oxidizing materials.
For safe handling information on this product, consult the Material Safety Data Sheet (MSDS).
For safe handling information on this product, consult the Material Safety Data Sheet (MSDS).
Direction for use
1. For best performance bond surfaces should be clean and
free from grease.
2. This product performs best in thin bond gaps (0.05 mm).
3. Excess adhesive can be dissolved with Loctite cleanup solvents, acetone.
free from grease.
2. This product performs best in thin bond gaps (0.05 mm).
3. Excess adhesive can be dissolved with Loctite cleanup solvents, acetone.
Storage
Store in the unopened container in a dry area, and storage instruction are indicated on the label of the bottle.
Optimal Storage: 2 °C to 8 °C. Storage below 2 °C or greater than 8 °C can adversely affect product properties. Material removed from containers may be contaminated during using. Do not return product to the original container. Heng ying Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact Heng Ying Adhesive Co.,LTD.
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